Grinding and Polishing Services

Many applications for CVD diamond films require a smooth as-grown surface, yet CVD diamond's properties make it extremely difficult to grind and polish. Applied Diamond uses specialized equipment and processes to produce CVD diamond wafers with a range of thickness and surface finishes.

CVD diamond films, as grown, often have peak-to-valley surface roughness of 10% of the film's thickness. In addition, compressive stress built up during the growth process can lead to bowed wafers. To create flat surfaces, Applied Diamond's grinding process works to remove the bow and reduce the peak-to-valley surface roughness to the range of 50nm.

Applied Diamond's unique polishing process further reduces surface roughness. Because of diamond's high hardness, wear resistance and low coefficient of friction, it is time-consuming to process large areas of diamond to very low surface roughness. Applied Diamond has a productive process for polishing areas below 1 sqcm to peak-to-valley surface roughness of 1nm and less.

Call us today to discuss your needs and a practical way of achieving your goals.