Polycrystalline CVD

We grow polycrystalline diamond on silicon substrates via a CVD process, normally in a 2” or 3” diameter format.  The thickness can vary from about a half a micron to over a millimeter.  The quality can vary widely from tool-grade material with high fracture toughness to fine optical material suitable for spectroscopy and electronic applications.  When necessary, we grind/polish the growth surface of these wafers and parts.  While the unpolished roughness starts at around 10% of the diamond thickness P-V, the polished roughness is reduced to about 10nm P-V.  This is similar to the roughness of the substrate side of the wafer.  We can then laser cut shapes as called for by our customers and arrange for various metallization schemes as needed.

Single Crystal Diamond

We have been making parts from single crystal diamond for 20 years now and are well known for our abilities in this area.  We’ve pioneered the use of HPHT synthetic diamond in many technical applications and have access to good supplies of this and natural stones.  Size is usually limited to about 6mm, either round or square, because this is the limit of what is normally available in the rough diamond marketplace.  Again, our polishing, laser cutting and metallization processes can be used to make a wide variety of parts.

We can grow single crystal diamond via our CVD process as well.  We do this primarily to control the nitrogen content to make diamond with a wider IR transparency and thermal conductivity.  The size limitations are the same as with natural diamond, though, since this growth is done on a single crystal diamond seed.  You can’t grow them bigger than the seed, unfortunately.

For more information regarding our single crystal diamond products, go to www.ddk.com